Polished Wafer process
Mirror polishment on single side, or both side.
Plate bonding
In order to polish wafer as mirror surface, wafers will be donded with seramic plate.
![自動接着装置](./img/settyaku.png)
Mirror polishing
High flatness and high purified wafer will be produced as high quality mirror surface by CMP process.
![研磨装置](./img/polish.png)